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Postponement of
AM3P2022, Hong Kong

On behalf the Conference Organizing Committee of AM3P2022, we’d like to inform you that the AM3P2022 conference originally planned to be hosted on Dec 12-14, 2022 in Hong Kong will be postponed to 22-24 May 2023 at the same conference venue.


Advances in Materials and Pavement Performance Prediction
 22-24 May 2023, Hong Kong

This is indeed a difficult decision for us. We have been closely monitoring the COVID-19 situation in Hong Kong, but unfortunately at this moment, we still have no full confidence that the quarantine requirement in Hong Kong will be completely removed by Dec 12, 2022, although it’s being gradually released. We also understand all of you need time to plan for your travel ahead. So, after a careful discussion with the Standing International Advisory Committee of the conference, we decided to postpone the conference to a date when there is completely no concern on travel to Hong Kong. We hope that the AM3P2022 in next May will be a complete face-to-face event where we can all freely interact with each other, while enjoying the attractions and foods in Hong Kong.

AM3P2022 has received more than 130 paper submissions so far. The first-round review results of these papers will be available in November 2022. Since the conference now is postponed, we will re-open the paper submission system till Jan 31 2023 for those who failed to submit papers by the original deadline due to the travel concerns, and a separate review process will be conducted. 

We know this is an extraordinary and unprecedented time for everyone, and we appreciate your understanding, patience, and continued support. We wish you to stay safe and healthy and look forward to welcoming you in Hong Kong in next May.


If you need any further information about the event, please send email to or visit the conference website at


With warmest wishes,

AM3P2022 Conference Organizing Committee

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